HKSTP announces the launch of the Student Internship Programme (SIP) 2026, which has been open for applications since mid-May 2026.-SIP 2026 is designed to equip students with essential skillsets, industry exposure, and professional networks, supporting their transition into the innovation and technology (I&amp;T) sector upon graduation. The programme also enables companies to engage early with emerging talent and contribute to workforce development.-Eligible HKSTP partner companies can receive funding support to employ qualified student interns, providing students with meaningful, hands-on experience in real-world business environments.-*Please note that funding support is allocated on a&nbsp;first-come, first-served basis.-For further details, please feel free to contact TecONE at 2629 2383 or sip@hkstp.org.

HKSTP Student Internship Programme 2026

Blooming with AI: HKSTP Summer Talent Fest 2026 cum Kick-off Ceremony for "AI for All" Inclusive Programme-Event Details:&nbsp;Date: 14 July 2026 (Tuesday) Time: 10:00 AM &ndash; 1:30 PM&nbsp; (Register at 10:00 AM) Venue: 1/F -2/F, Building 10W, Hong Kong Science Park, Shatin (The Golden Egg)-Event Rundown:&nbsp;10:00 AI+ Tech Showcase (Try the Tech Live - Experience groundbreaking AI straight from HKSTP park companies)11:00 Welcome Remarks &amp; Keynote Address | "AI for All" Inclusive Programme Kick-off11:30 The AI Leadership Forum (Real Strategies - Learn from industry leaders to navigate the dynamic I&amp;T landscape)12:00 Meet &amp; Spark (Unlock Your Next Milestones - Connect with founders and talents in a relaxing setting to land your next gig)-SIGN UP NOWIndustry Leaders, Founders, and Innovators Registration Link: <a href="https://2vx.io/Xci40uc" target="_blank" rel="noopener">https://2vx.io/Xci40uc</a>Students, Interns and Professionals Registration Link: <a href="https://2vx.io/DeGV7ct">https://2vx.io/DeGV7ct</a>

Blooming with AI: HKSTP Summer Talent Fest 2026

HKSTP Global Internship 2026

HYAB Youth Start-up Internship Programme (YSIP)

Talent Foundry

Send CV to hr@akerf.com​ 将简历发送至 hr@akerf.com ​Daily Administrative Reception​ 日常行政接待 ​Send and receive emails; receive visitors; arrange meetings 收发电子邮件；接待访客；安排会议 Dispatch and receive couriers and mail; manage office supplies and equipment 收发快递与邮件；管理办公用品与装备 Maintain office environment; coordinate with logistics suppliers 维护办公环境；与物流供应商协调 Documentation &amp; Archives​ 文档与档案管理 ​Format, print, scan, and archive documents in Chinese (Simplified &amp; Traditional) and English 格式化、打印、扫描和归档中文（简体和繁体）及英文文档 Compile meeting minutes; file contracts and government correspondence 整理会议纪要；归档合同与政府往来函件 Register seal usage; manage document filing 登记印章使用情况；管理文件归档 HR-Related Tasks​人力资源相关任务 ​Process employee onboarding and offboarding 办理员工入职与离职手续 Handle employee MPF account filings, including enrollment and termination 处理员工强积金账户申报，包括入职与离职登记 Assist in employer tax return filing; answer basic Employment Ordinance inquiries 协助雇主报税；解答《雇佣条例》基本咨询 Financial Support​财务支持 ​Collect and verify employee travel expense reimbursement claims 收集并核实员工差旅费报销申请 Record petty cash transactions; organize bills and submit to accounting 记录零用金交易；整理账单并提交至财务部 Hong Kong Company Compliance Support​ 香港公司合规支持 ​Receive and dispatch documents from the Companies Registry, Inland Revenue Department, and MPFA 接收并寄送来自公司注册处、税务局和强积金局的文件 Remind of annual returns and Business Registration renewal; coordinate with company secretary to compile materials 提醒年度申报和商业登记续期；与公司秘书协调整理材料 Business &amp; Other Duties​ 商务及其他职责 ​Communicate with clients and suppliers via email in both Chinese and English 通过电子邮件以中英文与客户和供应商沟通 Coordinate logistics for meetings, team-building events, and exhibitions 协调会议、团队建设活动和展会的物流事宜 Arrange cross-border document/sample shipping; handle ad hoc tasks assigned by management 安排跨境文件/样品运输；处理管理层分配的临时任务 一、日常行政接待收发电子邮件；接待访客；安排会议 收发快递、信件；管理办公用品及办公设备 维护办公环境；协调后勤供应商 二、文书档案对简体中文、繁体中文及英文文件进行排版、打印、扫描及归档 整理会议纪要；归档合同及政府信函 登记印章使用；管理文件档案 三、人事相关办理员工入职及离职手续 处理员工强积金账户申报，包括新增及注销 协助进行雇主报税；解答基础《雇佣条例》相关问题 四、财务辅助收集及核对员工差旅报销单据 登记零用现金；整理各类账单并提交至会计部门 五、香港公司合规辅助收发公司注册处、税务局及积金局文件 提醒周年申报及商业登记证续期；配合公司秘书整理相关资料 六、商务及其他以中英文邮件与客户及供应商沟通 协调会议、团建活动及展会的后勤筹备 安排跨境文件/样品寄送；处理管理层交办的临时事务

General administrative staff

崗位職責<ol><li>負責日常行政事務，包括文件整理、會議統籌安排、訪客接待、辦公環境管理，各類中英文信函、文檔處理、辦公場地租賃、商業登記等相關行政事務，確保辦公室運作順暢高效。</li><li>負責人力資源管理，包括但不限於招聘、薪酬計算、MPF、稅務申報及員工關係。</li><li>管理入職、離職流程，維護員工檔案及合約，確保符合香港勞工法例。</li><li>落實香港本地公司運營與人事用工合規事宜，熟悉《雇傭條例》、強積金 MPF、《個人資料 (私隱) 條例》、輸入內地人才計畫 ASMTP、入境處簽證、稅務 IRD、反歧視條例等香港相關法規，協助處理勞資相關諮詢、合約檔核對，保障人事行政工作合規。</li><li>負責輸入內地人才計畫、補充勞工優化計畫等人才引進工作，負責非本地雇員簽證申請的資料整理、材料籌備，對接入境處相關文書，跟進申請進度。</li><li>瞭解香港相關資助政策，主導公司各類資助項目申請與實施。</li><li>完成上級交辦的其他行政、人事及跨境人才相關支援工作。</li></ol>任職要求<ol><li>香港永久居民身份，人力資源或工商管理類相關專業大學畢業，歡迎應屆畢業生申請。</li><li>具備良好溝通能力，能以廣東話、普通話及基礎英文進行日常交流與書寫，文書表達清晰準確。</li><li>熟悉香港《僱傭條例》、勞工法例、MPF及稅務規定。</li><li>瞭解輸入內地人才計畫及香港入境相關政策法規。</li><li>工作細心嚴謹，條理性強，溝通協調能力良好，責任心強。</li><li>持有香港駕駛執照優先。有行政、人力資源實習或從業經歷者優先。</li><li>即時上班優先</li></ol>

行政人力專員

Sealincloud is developing an AI Decision Intelligence Platform that applies artificial intelligence technologies to support complex decision-making and intelligent service delivery.We are seeking an AI Application Engineer (Decision Intelligence Track) to join our R&amp;D team. The role focuses on designing, developing, and validating AI-enabled applications that transform complex information and user requirements into structured recommendations and actionable solutions.The successful candidate will work closely with engineering and product teams to build intelligent applications for cross-border service scenarios through AI integration, data-driven optimization, and user-centered product innovation.Key Responsibilities<ol><li> AI Application Development</li></ol><ul><li>Participate in the design and development of AI-enabled decision support applications.</li><li>Develop digital solutions that transform complex information into structured insights and recommendations.</li><li>Support the integration of AI functions into Web/App platforms.</li></ul><ol><li> Decision Intelligence and System Optimization</li></ol><ul><li>Analyze user requirements, decision factors, and service scenarios to improve intelligent workflows.</li><li>Support the development of recommendation, matching, and workflow optimization functions.</li><li>Conduct testing and evaluation to improve application performance and user experience.</li></ul><ol><li> Product Innovation and Technical Validation</li></ol><ul><li>Participate in prototype development, usability testing, and iterative product improvement.</li><li>Conduct technical experiments and analyze results to validate AI application approaches.</li><li>Document technical findings and contribute to continuous system enhancement.</li></ul>Qualifications &amp; RequirementsEducation Background<ul><li>Bachelor’s degree or above in:</li><ul><li>Decision Analytics;</li><li>Data Analytics;</li><li>Computer Science;</li><li>Information Systems;</li><li>Engineering or related disciplines.</li></ul><li>Candidates with experience in digital innovation, multimedia technology, human-computer interaction, or related fields are preferred.</li></ul>Technical Skills<ul><li>Understanding of decision analysis, data-driven modeling, or optimization methods.</li><li>Familiarity with AI applications, data analysis, or intelligent recommendation systems.</li><li>Basic programming knowledge in Python, JavaScript, or related technologies.</li><li>Experience in Web/App development, UX design, or digital product development is an advantage.</li></ul>Preferred Attributes<ul><li>Strong analytical thinking and problem-solving skills.</li><li>Ability to translate complex problems into structured solutions.</li><li>Interest in AI applications, decision intelligence, and emerging technologies.</li><li>Ability to work in a multidisciplinary R&amp;D environment.</li></ul>

AI Application Engineer (Decision Intelligence Track)

Job Description: <ul><li>Conduct research work of projects focused on immersive digital technology aspects for the company strategies.</li><li>Recruit study participants, perform clinical trials, collect data, perform basic data analysis, and participate in report preparation.</li><li>Participate in the development, tests, and validation of the software prototype for the product.</li><li>Research on management information system for ongoing research projects.</li><li>Independent research and analysis skills and create timely materials and reference for the scientific research team.</li></ul>Requirements: <ul><li>Bachelor’s or above in Computer Science, Electrical/ Electronic Engineering, Information Engineering or relevant disciplines.</li><li>Knowledge in software development, C/C++ and Python programming is preferred.</li><li>Strong attention to detail and problem-solving skills.</li></ul>

Research Engineer (R&D)

Job Highlights<ul><li>Senior‑level analog and mixed‑signal IC design role</li><li>High‑speed signal‑conditioning and interface products</li><li>SiGe BiCMOS and deep sub‑micron CMOS technologies</li><li>End‑to‑end silicon responsibility from architecture definition to silicon bring‑up</li><li>Clear growth path toward Principal / Technical Lead positions</li></ul>Principal Duties and Responsibilities<ul><li>Act as a senior contributor in an analog/mixed‑signal IC development team, performing circuit design and verification for high‑speed products.</li><li>Define and own block‑level architecture, participate in system‑level architectural decisions, including performance, power and robustness trade‑offs.</li><li>Lead assigned designs from front‑end concept through schematic design, layout supervision, physical verification and tape‑out, aligning with overall product architecture.</li><li>Execute design verification, including transient, AC, noise, corner, Monte Carlo simulations and assess design margins.</li><li>Work closely with layout engineers to ensure proper matching, parasitic control and signal‑integrity‑aware implementation, providing clear technical direction.</li><li>Support post‑silicon bring‑up, validation and characterization, including lab measurements, silicon debug and correlation with simulation results.</li><li>Collaborate with product engineering, application engineering and test teams to support product qualification and production ramp.</li><li>Provide technical support for customer design‑in, debug and failure analysis as required.</li><li>Take ownership of design quality, technical risk and schedule commitments for assigned blocks or features.</li></ul>Knowledge, Skills and Abilities<ul><li>M.S. in Electronic Engineering with 5+ years of relevant industry experience; PhD is a plus.</li><li>Proven experience in analog and mixed‑signal IC design with successful silicon tape‑outs.</li><li>Strong background in high‑speed analog circuit design, such as signal conditioning, equalization, clocking or data‑path circuits.</li><li>Experience with RF IC, SerDes or gigabit‑speed interfaces (e.g., USB, HDMI, DP, MIPI, PCIe) is highly desirable.</li><li>Proficient with Cadence and Synopsys design flows, including Spectre/HSPICE simulation.</li><li>Strong analytical, debugging and problem‑solving skills, including post‑silicon root‑cause analysis.</li><li>Self‑motivated, detail‑oriented and comfortable operating independently within a collaborative team environment.</li><li>Good written and verbal communication skills in English and Chinese; Mandarin is a plus.</li></ul>Interested parties, please send application letter and full resume with date of availability, current and expected salary. Please also quote the reference number on the application.Personal data provided will be treated in strict confidence and used for recruitment purpose only. Only shortlisted candidates will be notified. Applicants not invited for interview within eight weeks from the date of application may consider their applications unsuccessful.

Senior Analog IC Design Engineer

Koryis is building Hong Kong’s most advanced AI‑powered learning platform for secondary schools. We are seeking a Lead EdTech Instructional Designer &amp; Pedagogical R&amp;D Specialist to architect our curriculum intelligence engine, design adaptive learning pathways, and lead pedagogical research aligned with HKDSE standards.This role is central to the quality of our learning library and the accuracy of our adaptive student evaluation systems. You will serve as Koryis’s curriculum authority, ensuring our content, diagnostics, and pedagogy meet the expectations of Hong Kong educators and the Education Bureau. Key R&amp;D Responsibilities <ol><li> Pedagogical System Architecture &amp; HKDSE Curriculum Mapping</li></ol><ul><li>Conduct applied research to map Hong Kong EDB curriculum frameworks (Junior Secondary + HKDSE Senior Secondary) into structured, granular knowledge graphs.</li><li>Build hierarchical concept maps across core KLAs: Mathematics, Science, Technology Education, and elective subjects.</li><li>Develop cognitive assessment taxonomies (e.g., digital Bloom’s Taxonomy, cognitive load bands) to classify learning assets by difficulty, conceptual dependency, and cognitive demand.</li><li>Define mastery thresholds and progression models for HKDSE‑aligned competencies. 2. School Integration &amp; Curriculum Validation•Lead pilot research with teachers, department heads, and curriculum coordinators.•Produce research reports demonstrating improvements in mastery, retention, and diagnostic accuracy.</li><li>Ensure all learning assets meet EDB expectations for curriculum alignment, assessment readiness, and classroom usability.</li><li>Collect quantitative and qualitative feedback to validate learning efficacy in live classroom environments.</li><li>Work directly with Hong Kong secondary schools to field‑test adaptive curriculum models. Candidates must obtain Master’s degree or PhD in: Educational Technology⁠ Learning Sciences ⁠Cognitive Science Graduated from a Hong Kong university or a top global institution. Professional &amp; Domain Expertise Prior experience as a secondary school teacher, panel head, curriculum officer, or EdTech specialist in Hong Kong. Experience designing curriculum, assessments, schemes of work, or digital learning resources. Deep knowledge of the Hong Kong secondary curriculum (S1–S6), HKDSE standards, and EDB Key Learning Areas.</li></ul>

Lead EdTech Instructional Designer & Pedagogical R&D Specialist

Position OverviewWe are seeking a highly skilled and dynamic Optical Engineer / Scientist to join our team. The ideal candidate has a strong background in optics, thermal imaging, electro‑optical systems, and algorithmic modelling, with solid programming skills (Python required; C advantageous). The role spans the full optical path of our LWIR, low‑cost, mass‑market thermal imaging sensors—from lens evaluation and system modelling to image processing and application‑driven performance assessment.You will work closely with lens vendors, internal sensor experts, and our cross‑functional R&amp;D team to ensure that Meridian’s optical solutions meet the demanding requirements of consumer‑scale thermal imaging. As a small and agile team opening a new market, everyone—including you—will also engage directly with customer support and application engineering.Key Responsibilities<ul><li>Evaluate and characterize LWIR optics, including lens samples, vendor designs, and complete thermal imaging modules.</li><li>Work with lens vendors to assess optical designs against Meridian specifications and manufacturing constraints.</li><li>Perform optical, radiometric, and electro‑optical characterization of fully built imagers.</li><li>Model thermo‑electro‑optical system behavior, including lens‑sensor interactions, stray‑light effects, and system‑level performance.</li><li>Develop and implement image‑processing and correction algorithms (Python; C advantageous).</li><li>Contribute to the design and optimization of lens holders, module mechanics, and system integration.</li><li>Conduct experimental work to evaluate lens applicability across different consumer verticals and use‑cases.</li><li>Collaborate with process development and manufacturing teams to understand sensor limitations and leverage sensor advantages.</li><li>Support application algorithm development for smart appliances, homes, and city infrastructure.</li><li>Participate in customer support and application engineering—helping customers understand capabilities, constraints, and integration pathways.</li></ul>Qualifications<ul><li>Ph.D. or Master’s degree in Optics, Physics, Engineering, or a related field.</li><li>Extensive experience with optical systems, thermal imaging, or other electro‑optical sensors.</li><li>Strong proficiency in Python; experience with C is a plus.</li><li>Experience in physical modelling, system modelling, or data/AI‑driven image processing.</li><li>Hands‑on experience with optical characterization tools and methods.</li><li>Strong analytical and problem‑solving skills.</li><li>Excellent communication and teamwork abilities.</li><li>Experience in developing algorithms for smart or consumer technology is advantageous.</li></ul>What We Offer<ul><li>Competitive salary and benefits package.</li><li>Opportunity to work with cutting‑edge technology and innovative products.</li><li>Professional growth within an exceptional international team.</li><li>A collaborative and dynamic work environment.</li><li>The chance to make a meaningful impact on health, safety, comfort, and energy efficiency through state‑of‑the‑art technology.</li></ul>How to ApplyPlease submit your resume and a cover letter detailing your relevant experience and why you are interested in joining Meridian Innovation to hr@meridianinno.com.

Scientist / Optical Engineer

<ul><li>Pipeline Robotics Software EngineerCompanyBonbon-X Limited is a robotics technology company specializing in underground pipeline inspection robots. We develop robotic systems for confined-space inspection, real-time visual data acquisition, AI-assisted crack detection, and pipeline condition assessment.PositionPipeline Robotics Software EngineerLocationHong Kong Science ParkEmployment TypeFull-time ContractSalary RangeHK$18,000 – HK$23,000 per month Final package will depend on experience and technical capability.Job Highlights<ul><li>Robotics software development for underground pipeline inspection robots</li><li>Embedded-to-software system integration</li><li>AI crack detection and real-time pipeline monitoring support</li><li>Robot telemetry, inspection data workflow, and reporting system development</li><li>Opportunity to work on real-world infrastructure and government-related robotic applications</li></ul>Key Responsibilities<ul><li>Conduct research on software modules for underground pipeline inspection robotic systems.</li><li>Derive embedded-to-software communication between robot hardware, sensors, cameras, and ground station systems.</li></ul>Integrate robot telemetry data, camera data, sensor data, and inspection records into the ground station or backend system.Work closely with embedded, mechanical, and AI engineers to support robot control, data transmission, and field testing.<ul><li>Manage AI crack detection model development, data collection, labelling workflow, testing, validation, and deployment for real-time pipeline monitoring.</li></ul>Develop internal tools for inspection data management, pipeline defect recording, reporting, and system performance analysis.Support field deployment, debugging, system integration, and R&amp;D validation for pipeline inspection robots.Prepare technical testing records, R&amp;D milestone reports, system validation documents, and project progress documentation.Participate in continuous improvement of the robot software architecture, inspection workflow, and data standardization process. Requirements<ul><li>Degree holder in Computer Engineering, Computer Science, Electronic Engineering, Robotics, Mechanical Engineering, Artificial Intelligence, Data Science, or other related STEM discipline.</li><li>1–3 years of experience in software development, robotics software, embedded systems, AI application, or engineering system integration. Fresh graduates with strong technical capability may also be considered.</li><li>Basic knowledge of Python, C/C++, JavaScript, Node.js, MySQL, or related software development tools.</li><li>Knowledge of robotics systems, embedded systems, computer vision, sensor data processing, or industrial inspection systems is an advantage.</li><li>Experience in robotic systems, pipeline inspection, CCTV inspection, real-time monitoring, or infrastructure defect analysis is preferred.</li><li>Experience in AI crack detection model development, model training, testing, deployment, or validation is a strong advantage.</li><li>Experience with YOLO, CNN, Transformer-based vision models, OpenCV, PyTorch, TensorFlow, or related computer vision frameworks is a plus.</li><li>Knowledge of ROS, SLAM, autonomous navigation, CAN communication, Ethernet communication, sensor fusion, or robot telemetry is an advantage.</li><li>Good documentation, testing, debugging, and problem-solving skills.</li><li>Willing to participate in field testing, robot deployment, and system integration work.</li></ul>Language Requirements<ul><li>Good command of Cantonese, Mandarin and English is preferred.</li><li>Japanese language capability is an advantage, especially for overseas technical communication, supplier liaison, or Japan-related partnership development.</li></ul>Preferred Qualities<ul><li>Strong interest in robotics, infrastructure technology, AI inspection, and real-world engineering applications.</li><li>Able to work with hardware, software, and field operation teams.</li><li>Detail-minded, responsible, and willing to learn new technologies.</li><li>Comfortable working in a startup environment with hands-on engineering tasks.</li></ul>Why Join Bonbon-XAt Bonbon-X, you will work on practical robotics technology for underground infrastructure inspection. Our team develops pipeline inspection robots that help reduce human-entry risk, improve inspection efficiency, and support smart city infrastructure maintenance.</li><li>The candidate will participate in R&amp;D work involving robot software, embedded data communication, AI crack detection workflow, inspection data processing, and field validation.</li><li>Our mission is to reduce the need for human-entry inspection in hazardous underground environments and improve the safety, efficiency, and accuracy of infrastructure inspection.</li></ul>

Pipeline Robotics Software Engineer

Job Responsibilities： Layout Design and Implementation: Responsible for chip floorplanning (including at the TOP level and module level), physical implementation (placement and routing), and comprehensive verification (such as DRC, LVS, DFM) to ensure the design complies with process rules and performance targets. Verification and Optimization: Conduct physical verification, parasitic parameter extraction and post-simulation using EDA tools (e. g. Calibre), optimize the performance of the layout, and compile relevant design documents. Process and Collaboration: Establish and optimize layout design processes and specifications; serve as the project lead layout engineer (TOP Layout), take charge of or be deeply involved in layout planning, and collaborate closely with teams including circuit design, process, and testing to ensure successful tapeout. Data Delivery and Verification: Responsible for or involved in generating the final tapeout data package (GDSII) and completing pre-tapeout data verification (JDV) Qualifications： Academic Background: Bachelor's degree or above, majoring in microelectronics, electronic engineering, materials, physics or other related fields. Professional Skills: Proficient in mainstream layout design tools such as Cadence Virtuoso and Synopsys IC Compiler, as well as physical verification tools including Calibre. Familiarity with semiconductor processes and procedures such as CMOS, BCD, and FinFET, with successful tapeout experience is preferred. Deeply understand the key knowledge of layout design, such as parasitic effects, device matching, signal integrity, ESD, Latch-up and other reliability design contents. Additional Capabilities: Good at XFN communication and coordination, and a strong team player. Those who master scripting languages such as Skill, Python and Perl, and are capable of automation design or Pcell development are preferred. Candidates with experience in complex chip layout design such as digital-analog hybrid, high-voltage or radiofrequency chips are preferred.

Where Talent Meets Opportunity